Jedec, Tray
Jedec Trays
Jedec Trays
We offer Jedec trays that reflect our relentless pursuit in design philosophy to combine the best of both worlds - maximum durability and light weight.
Each of our tray designs is subjected to rigorous testing and qualification.

We offer various materials for a wide range of operational temperature requirements. Our full range of materials offering will be able to satisfy your cost and performance considerations.

SELECTION CHART

DESIGN
We agree wholeheartedly with Thomas Edison. Good designs are about hard work. Let us sweat the details for you so that you can concentrate on your core competency of making chips. Many of the multinational semiconductor companies have benefited from our tireless effort to find good design solutions for them. Here are just a few samples from thousands of design projects that we have completed.

How can you ensure your semiconductor components are protected with the right JEDEC tray material for your specific temperature and operational requirements?
ITW EBA's JEDEC trays feature a comprehensive selection of materials specifically engineered for wide-ranging operational temperatures. Our rigorous testing and qualification processes ensure maximum durability and lightweight design, protecting your valuable chips throughout the supply chain. Contact our engineering team to discuss your specific temperature requirements and discover how our proven JEDEC tray solutions can optimize your packaging performance and reduce costs.
Our JEDEC tray portfolio reflects ITW EBA's commitment to meticulous engineering and attention to detail. We offer various material options tailored to specific temperature ranges and operational environments, ensuring compatibility with your production requirements. As a subsidiary of Illinois Tool Works with global resources and 109 years of industry heritage, ITW EBA combines corporation-wide expertise with innovative design solutions. Whether you require standard JEDEC configurations or custom-engineered trays, our engineering team works tirelessly to develop solutions that allow you to concentrate on your core competency of chip manufacturing while we handle the complexities of precision component packaging.


