Carrier Tape for IC Packaging | ITW EBA
ITW EBA's wafer level CSP carrier tape delivers precision embossing, consistent indexing, and low contamination for semiconductor packaging applications.
Carrier Tape
Carrier Tape
Carrier Tape
Match Metal Technology (MMT) is our unique manufacturing capabilities, which combine proprietary automated high speed pocket embossing and hole punching equipment with precision embossing dies, deliver several advantages - such as consistent indexing hole pitch, low pocket dimension variation and uniform wall thickness.
MMT forming vs conventional vacuum/compressed air pressure forming
OUR WAFER LEVEL CSP CARRIER TAPE 
is your answer to the industry challenge in bare die and wafer level applications. We offer Polycarbonate material and male rotary forming technology that deliver high performance for this ”mission critical” application. Sharp pocket corners, low ionic contamination and stable dimensions are the must haves in your selection criteria.
DESIGN
A picture is worth a thousand words. Take a look at some of our design portfolio and contact us if you see something that you like.
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How can you ensure bare die and wafer-level components maintain dimensional stability and minimal contamination throughout your packaging process?
ITW EBA's wafer-level CSP carrier tape with polycarbonate material and male rotary forming technology delivers sharp pocket corners, low ionic contamination, and stable dimensions—the must-haves for mission-critical semiconductor applications. Our proprietary Match Metal Technology (MMT) outperforms conventional forming methods, ensuring consistent indexing and superior pocket precision. Let our 50+ years of IC packaging expertise optimize your semiconductor manufacturing efficiency. Request a technical consultation with our specialists today.
With over 50 years of industrial electronics manufacturing expertise, ITW EBA delivers carrier tape solutions backed by Illinois Tool Works' global resources and engineering excellence. Our comprehensive design portfolio accommodates diverse packaging requirements, and our technical team stands ready to collaborate on custom-engineered solutions. Whether you're managing bare die handling, wafer-level applications, or complex IC packaging scenarios, our carrier tape provides the precision, consistency, and contamination control necessary to maintain product integrity and manufacturing efficiency. Contact our specialists today to discover how ITW EBA's carrier tape can optimize your semiconductor packaging operations.