ILM provides the force needed to seat the 115x-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly locatin is dependent on manufacturing preference and test flow.

產品特性

• Intel approved
• Intel validated design for both LGA1155 and LGA1156 Sockets
• Successfully passed Intel lnterchangeability test with sockets from various suppliers
• Successfully passed all Intel ILM ergo requirements
• RoHS compliant

相關產品

金属背板

客制化的金属背板，可以有效紧固CPU的散热模块。

细节